Page 673 - The Central Motor Vehicles Rules, 1989
P. 673

ANNEXURE XI       THE CENTRAL MOTOR VEHICLES RULES, 1989             645

                                        (h) Operating ambient temperature range -25C to +55C.
                                        (i) For Poly  Vinyl Chloride (PVC):  Glossy  surface, Poly Vinyl  Chloride
                                            (PVC)/Acrylonitrile Butadiene Styrene (ABS)/PetG plastic construction,
                                            with overlay to allow colour dye sublimation printing.
                                        (j) For  Polycarbonate Card: Multi-layered card construction  using  pure
                                            polycarbonate layer, fused (laminated) together with heat and pressure
                                            without any kind of glue or adhesive. Card Body material including outer
                                            overlay shall be capable of personalisation through Laser engraving.
                                 II.  Material Specifications for Driving License and Registration Certificate
                                        (a) Dimension of the Card : The cards used for the Driving License and
                                            Registration Certificate shall be compliant to ISO/IEC 7810 standard as
                                            defined for ID-1 unused and returned cards. The tolerances, edge burrs etc.
                                            shall be as defined for the ID-1 cards in ISO/IEC 7810 section 5. All
                                            dimensions of the card shall be measured as per the ISO/IEC 10373-1
                                            standard as defined in section 5.2 under the standard testing conditions as
                                            defined in ISO/IEC 10373-1.
                                        (b) Card Warpage and Surface Distortion : The maximum distance from a flat
                                            rigid plate to any portion of the convex surface of the card shall not be
                                            greater than 1.5 mm including the card thickness. Further, the difference
                                            between the maximum and minimum thickness of the finished card shall
                                            not be more than 0.10 mm. For measuring the maximum and minimum
                                            thicknesses, the contact chip shall also be considered. Thus, no point of the
                                            entire IC contact surface shall be higher than 0.10 mm above or lower than
                                            0.10 mm below the adjacent surface of the card. The test shall be carried out
                                            using the standard measurement method as described in ISO/IEC10373-1.
                                        (c) Card Material and Construction. : The cards shall be made of Polyvinyl
                                            Chloride (PVC), Acrylonitrile Butadiene Styrene (ABS) or PetG or Poly
                                            Carbonate  (PC) plastic  material unless specified  otherwise. The  card
                                            construction shall  be made  of bonded materials  with inserts of  the
                                            ISO7816-2 compliant contact chip (for ICC) if provided, or with inserts of
                                            the ISO144443 compliant contactless chip with associated antenna (for
                                            PICC), if provided.
                                        (d) Card Characteristics : The card characteristics shall  be as  defined  in
                                            ISO/IEC 7810 standard as outlined here:—
                                             (i) Bending Stiffness :
                                               (1) The bending stiffness shall be as defined in ISO/IEC 7810. The test
                                                   procedures shall be as described in ISO/IEC 10373-1 section 5.7.
                                                   For carrying out the bending stiffness test, the cards shall be
                                                   exercised in the following four configurations, namely:—
                                                   (a) With the embedded chip facing upward and the edge of the
                                                      card closer to the chip placed towards the clamping device.
                                                   (b) With the embedded chip facing upward and the edge of the
                                                      card closer to the chip placed away from the clamping device.
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