Page 673 - The Central Motor Vehicles Rules, 1989
P. 673
ANNEXURE XI THE CENTRAL MOTOR VEHICLES RULES, 1989 645
(h) Operating ambient temperature range -25C to +55C.
(i) For Poly Vinyl Chloride (PVC): Glossy surface, Poly Vinyl Chloride
(PVC)/Acrylonitrile Butadiene Styrene (ABS)/PetG plastic construction,
with overlay to allow colour dye sublimation printing.
(j) For Polycarbonate Card: Multi-layered card construction using pure
polycarbonate layer, fused (laminated) together with heat and pressure
without any kind of glue or adhesive. Card Body material including outer
overlay shall be capable of personalisation through Laser engraving.
II. Material Specifications for Driving License and Registration Certificate
(a) Dimension of the Card : The cards used for the Driving License and
Registration Certificate shall be compliant to ISO/IEC 7810 standard as
defined for ID-1 unused and returned cards. The tolerances, edge burrs etc.
shall be as defined for the ID-1 cards in ISO/IEC 7810 section 5. All
dimensions of the card shall be measured as per the ISO/IEC 10373-1
standard as defined in section 5.2 under the standard testing conditions as
defined in ISO/IEC 10373-1.
(b) Card Warpage and Surface Distortion : The maximum distance from a flat
rigid plate to any portion of the convex surface of the card shall not be
greater than 1.5 mm including the card thickness. Further, the difference
between the maximum and minimum thickness of the finished card shall
not be more than 0.10 mm. For measuring the maximum and minimum
thicknesses, the contact chip shall also be considered. Thus, no point of the
entire IC contact surface shall be higher than 0.10 mm above or lower than
0.10 mm below the adjacent surface of the card. The test shall be carried out
using the standard measurement method as described in ISO/IEC10373-1.
(c) Card Material and Construction. : The cards shall be made of Polyvinyl
Chloride (PVC), Acrylonitrile Butadiene Styrene (ABS) or PetG or Poly
Carbonate (PC) plastic material unless specified otherwise. The card
construction shall be made of bonded materials with inserts of the
ISO7816-2 compliant contact chip (for ICC) if provided, or with inserts of
the ISO144443 compliant contactless chip with associated antenna (for
PICC), if provided.
(d) Card Characteristics : The card characteristics shall be as defined in
ISO/IEC 7810 standard as outlined here:—
(i) Bending Stiffness :
(1) The bending stiffness shall be as defined in ISO/IEC 7810. The test
procedures shall be as described in ISO/IEC 10373-1 section 5.7.
For carrying out the bending stiffness test, the cards shall be
exercised in the following four configurations, namely:—
(a) With the embedded chip facing upward and the edge of the
card closer to the chip placed towards the clamping device.
(b) With the embedded chip facing upward and the edge of the
card closer to the chip placed away from the clamping device.